[choose] An Object Oriented Software Architecture for Semiconductor Manufacturing Machines: A Case Study
metz at glue.ch
Fri Sep 2 11:43:55 MEST 2005
The CHOOSE executive board and Zühlke Engineering AG are pleased to
invite you to a presentation.
An Object Oriented Software Architecture
for Semiconductor Manufacturing Machines:
A Case Study
When: Wednesday 28. September 2005, @17h00
Where: Zühlke Engineering AG, Wiesenstrasse 10a, 8952 Schlieren
NOTE: registration for this event is required because we have to prepare
the apero. Please fill out the registration form at the end of this
Alexander Beck, Unaxis
Daniel Tobler, Zühlke
17h00 - 18h15 Talk and Q/A
Afterwards you are invited to a refreshment.
Bonding machines (bonders) are automated chip assembly equipment used in
the semiconductor industry to package microchips. Thousands of bonders
are used in large microchip plants throughout Asia. The company, Unaxis
Switzerland Ltd. Assembly & Packaging (ESEC), in Cham has been
developing such bonders for many years.
There are basically two types of bonders, wire bonders and die bonders.
Die bonders pick dice (silicon chips) from a wafer on which microchips
have been photolyticly produced and attach them to a carrier material. A
die bonder has to rapidly place dice very accurately. The latest
generation of die bonders place up to four dice per second. Wire bonders
place gold wires from the die to the carrier, so that the die's logic
can connect to the outside world. A wire bonder has to be even more
accurate and connects up to 20 wires per second.
This speech focuses on the control software for the bonder. It is
programmed completely in C++. A modular, layered and encapsulated
architecture is emphasized. Its size is around some hundred thousand
source lines of code and currently several dozen software developers
work on the project.
This speech focuses on the following topics:
* What does a bonder do and what are the processes that must be
controlled by the software shown as an example of a die bonder.
* How the different layers and subsystems were identified and
which methods were suitable.
* How the control software is distributed on different computer
systems and what aspects led to this decision including the
communication between these processes.
* How does the software design consider the parallel tasks that
must be controlled and which patterns suited our parallel
software more and which less.
* Data entry for production setup supporting an undo function
and system wide dependencies on changing dependant data.
* Efficient project controlling: Which processes proved of value
and which processes did not.
Alexander Beck has been working for more than 5 years in the area of
object-oriented software engineering. He graduated in 1999 from the
Swiss Federal Institute of Technology Zurich with a M. Sc. in Computer
Science. After finishing his education, Alexander Beck developed
software at ESEC (today Unaxis Switzerland) in several R&D projects for
new chip assembly bonding machines. Since the beginning of 2005, he is a
Software Architect for the new generation of die bonder machines.
Daniel Tobler has been working for more than 10 years in the area of
object-oriented software engineering. He graduated in 1995 from the
University of Applied Sciences in Rapperswil with a B. Sc. in Electronic
Engineering. In 1998 he received a Post-graduate Diploma in Software
Engineering from the same University. After his studies, Daniel Tobler
developed software for embedded systems for Siemens Building
Technologies. At ESEC, he was responsible as a Project Manager for the
development of the software for a new Wire-Bonder and worked afterwards
as a Software Architect on various projects in the same domain. Since
2005, he has worked at Zühlke as a Software Architect for embedded and
Daniel Tobler lectures object-oriented design in a post-graduate course
at the University for Applied Sciences in Rapperswil and regularly
supervises diploma projects related to this course.
This event is free even the drinks after the talk! Non-CHOOSE members
are encouraged to fill out the membership application form
(http://www.s-i.ch/si-appl.html) before attending the meeting. If you
want to know more about CHOOSE and the events which CHOOSE organises,
please visit http://www.choose.s-i.ch/.
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